3D solder paste inspection device 'TR7007DI'
Built on 3D projection technology, it offers excellent inspection performance with high cost-effectiveness!
The TR7007DI is a highly reliable SPI device that employs dual-direction projection inspection to achieve accurate inspections. Built on 3D projection technology, it offers excellent inspection performance with high cost-effectiveness. To achieve top-class inspection performance, it compensates for board warpage through TRI's innovative technologies, including automatic optimization of inspection routes and the SmartWarp system. 【Features】 ■ 100% shadow-free dual-direction digital fringe projector ■ Optimized Stop&Go design aimed at maximum precision ■ Accurate inspection even for deformed printed circuit boards thanks to the SmartWarp correction system ■ 100% detection of defects in solder paste, including low solder bridges *For more details, please refer to the PDF materials or feel free to contact us.
- 企業:ティアールアイ ジャパン 日本支社
- 価格:Other